Looking for a Principal Packaging Engineer to support new product development. Candidate will be the RF packaging interface between design teams and internal/external manufacturing. Your primary responsibilities will be Working with IC design teams to define the package requirements. Ownership of specific product from feasibility stage to high volume production. Ensuring

Manage a team of CAD and EDA engineers and provide technical guidance and mentorship. Define and implement CAD and EDA strategies and roadmaps for BAW and SAW filter design, simulation, and verification. Collaborate with cross functional teams, including device design, process integration, packaging, and test engineering, to ensure alignment and compatibility of CAD and E

Develop RF IP block designs to meet product design teams' requirements with all the necessary collaterals including documentation and integration guides Update existing IP block designs to serve the needs of various design team Spend 50% of time on direct product development of LNA, switch, and PA dies that are integrated into Skyworks RF front end modules Qualifications

As a Principal Application Engineer, you will have both an internal and external facing role. Internally, you will be working with our design teams to help optimize customer reference designs and you will interface directly with our Product Line Management, Systems, and Marketing teams. Externally, you will be involved in optimizing customer designs and to provide directi

Clean up and expansion of current part and symbol libraries. Maintain database/library of EVB footprint and symbols library utilizing Orcad CIP Create new Allegro footprints and Orcad schematic symbols. Creation of technology files to define standard PCB construction definitions. Create and standardize PCB/ATE cross sections across business units. Clean up and expansion o

Perform wafer fabrication by following work instruction and documented procedures. Operate equipment to perform various stages of the wafer fabrication process. Perform measurements and analysis of critical parameters and record data. Adhere to clean room protocol and work practices, including wearing PPE for long periods of time. Maintain proper documentation and records

The AIS group within Skyworks create mixed signal ASICs targeted at audio and wireless audio applications. These are highly integrated designs incorporating audio codecs, amplifiers, battery chargers, DSP processors, peripherals, and power control systems that support a wide range of communication interfaces. The platform SDK Firmware group works with the hardware team to

This position is for a Principal Design Engineer of RF acoustic wave filters in Skyworks' Irvine Design Center. You'll be working as part of an elite team of RF professionals creating the technology for next generation cellular handsets and other wireless communication devices and applications. Your job function will focus primarily on the design of acoustic filters, incl

The Process Engineering group at Skyworks in Woburn, Massachusetts is responsible for developing and supporting all wafer fabrication processes used to produce Skyworks' diverse portfolio of products. The primary device technologies include HBT, BiFET, BiHEMT, and pHEMT at various performance nodes. The group works closely with the Advanced Technology Development team to

Seeking an experienced analog/mixed signal design engineer for developing complex mixed signal ICs for Timing and Infrastructure applications. The position requires a strong analog mixed signal design background including a strong history of innovative product and IP definition and design. Depending on experience level, the individual will participate in product roadmaps,

If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high performance analog semiconductors, whose solutions are powering the wireless networking revolution. At Skyworks, you will find an environment with a strong focus on global collaboration and the freedom to make meaningful contributions

Work with a multidisciplinary team of PA, RF switch, LNA, Filter, and multi chip module (MCM) designers to support fully integrated front end module designs Coordinate with test engineering (TE), systems engineering (SE), product engineering (PE), and design verification test (DVT) teams to characterize front end modules (FEM) from initial design through high volume produ

Responsibilities You'll join a uniquely collaborative, multi discipline engineering community working across our domestic design centers creating cutting edge products for global markets. You will lead a diverse IC layout and RF MCM/EVB layout team as they provide layout services to product development teams designing silicon RF front end modules (PAs, filters/duplexers,

Qualifying new EM simulation tools and tool updates with automated regression tests. Develop and maintain automation to support shared EM models for lumped parts and internally designed integrated circuit (IC) parts, and assembly into module EM design. Manage project environment for SiP module design, including design sharing and part library access. Support PC installati

Work with a multidisciplinary team of PA, RF switch, LNA, Filter, and multi chip module (MCM) designers to support fully integrated front end module designs Coordinate with test engineering (TE), systems engineering (SE), product engineering (PE), and design verification test (DVT) teams to characterize front end modules (FEM) from initial design through high volume produ